This Mech-El MEI Marpet 1204B Manual Gold Ball Wire Bonder with Ball Bump Option looks to be in good cosmetic condition, showing some signs of wear. It comes with a B&L SZ4 Microscope, a Uthe 10G Ultrasonic Gene United States Click to Request Price Trusted Seller West-Bond 7600C Deep Access 90° Feed Wedge Wire Bonder (refurbished) USED

We made a manual wire bonder to prep samples that can be mounted in any orientation normal to the sample top down (0 degrees) or cross-sectional imaging (90 degrees). You can have very close working distances and have an electrical contact from your device to the chip carrier. Sample prep can be done in advance and tested outside of the SEM.

The iBond5000-Wedge is an advanced wedge bonder- manual wire bonder- used for process development, production, research, or added manufacturing support.

Kulicke & Soffa iBond5000 Manual Wire Bonder for wedge and ball bonding of: - Al wires (20-76 μm) - Au wires (12.7-76 μm) - ribbons (up to 25 x 250 μm) 

With over 30 years of wire bonding experience the current range of MPP manual wire bonder’s include the i5000B Ball Bonder, i5000W Wedge Bonder and i5000D Dual Bonder, which has both ball bonding and deep access wedge bonding capabilities. The equipment is used for process development, production or research of microelectronic and related

The HB05 manual series bench top wire bonder is easy to use and ideal for laboratories, pilot production runs and small scale production lines, configurable with a single bondhead for ball and wedge bonding.. An intuitive user interface provides the user to access to all of the bond parameters and bonding recopies stored on the machine.

HB05. Manual Wire Bonder. ​. Ideal for laboratories and pilot production lines. Wedge, Ball, Bump and Ribbon bonding. 17µ to 75µ Wire & 25µ x 250µ Ribbon.

The general difference between "Automatic" bonding wedges and "Manual" bonding wedges The notch style wedge is designed for use on manual wire bonders.

K&S 4524 Digital Ball-Wedge Bonder Application Gold wire (25µm - 50µm diameter) ball-wedge bonding K&S 4523A Digital Wedge-Wedge Bonder Application Aluminum 

This chapter describes the K&S 4500 Series Manual Wire Bonders controls and indicators. 1.1 The Multi Mouse The Multi Mouse is located on the base either to the right or the left of the workholder table. The Multi Mouse has two functions: Control of the bonding cycle. Fine positioning of the bonding pad under the wedge/capillary.

HB06/12 is a manual/ semiautomatic thermo sonic wire or ribbon wedge bonder. This bonder was designed to make 0.5 to 3.0 mil gold or aluminum wire or up to 1.0 x 10. 0 mil gold or aluminum ribbon electrical interconnections on a wide range of microelectronic packages. HB08/14 is a manual/ semiautomatic thermosonic wire ball bonder. This bonder

WEST•BOND MODEL 7476D SERIES INSTRUCTION MANUAL Page 5 FEATURES DESCRIPTION Feature -45E: Free Furnace, 2"x2" Adapter, Vacuum Hold The "E" version of the basic-45 Free Furnace modifies the upper portion of the furnace to extend its surface area to 2.000"(50.8mm) x 2.000"(50.8mm).

K&S Launches ULTRALUX™ Automatic Wire Bonder. ULTRALUX™ is the latest generation ball bonder utilizing the latest technologies and materials that will save LED manufacturers up to 10% capital cost. Learn More News. Discover recent K&S news and stories. View All News. Kulicke & Soffa Collaborates with LeYu Precision to Deliver Production

Industry Leader in semiconductor wire bonder, die bonder, wedge bonder, pull test and bonder tools. Leader in manufacturing renowned line of wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components, and accessories for the microelectronics packaging industry.

West-Bond 7400B Manual 45° Feed Wedge Wire Bonder (refurbished) USED Manufacturer: West Bond This West-Bond 7400B 45° Feed Manual Wedge Wire Bonder (s/n 12422) looks to be in good cosmetic condition, showing some signs of wear. We have a technician who refurbishes these machines for us, so we are sellin United States Click to Request Price

Model 7400D Series, Wedge-Wedge Wire Bonders, Manual X-Y-Z Overview Year 2000 saw the "C" Series finally replace the venerable "A" Series, and now witnesses the transition accepts the new tool assemblies of the wire bonders as well as other cast-body tool assemblies. The angled wedge wire bond configuration is shown below.

F&S Bondtec offers the perfect development machine with its manual wire bonder. Simple operation, extremely adaptable bonding settings, at an unbeatable price-performance ratio. - Complete, manual table top bonder - Unbeatable price-to-performance ratio - Extremely adaptable bond settings, loop shapes, force and power profiles etc.

The Model 4526 Auto-Stepback Wedge Bonder is used with aluminum wire, gold wire and. ribbon. It is especially appropriate for your high quality applications requiring tight control of. wire

Model 7400D Series, Wedge-Wedge Wire Bonders, Manual X-Y-Z Overview Year 2000 saw the "C" Series finally replace the venerable "A" Series, and now witnesses the transition accepts the new tool assemblies of the wire bonders as well as other cast-body tool assemblies. The angled wedge wire bond configuration is shown below.

Wire Bonder. Users Manual. Coral name: Wire Bonder. Model: Kulicke and Soffa 4526. Location: NanoFab Post-Processing Lab, Building 215. Contact:.

Series 53: Manual Wire Bonders. • Complete, manual table top wire bonder. • If you need 1 to 1,000 bonds/day. • Wire bonder for small production volumes, high quality requirements. • Dual wire clamp system for reproducible loop and tails. • Gold-ball, thin wire wedge-wedge, thin wire deep access, heavy wire, heavy ribbon.

The base model of this series is Model 7400E, an ultrasonic/thermosonic wedge-wedge wire bonder designed to interconnect wire leads to semi-conductor, hybrid or 

Motorized Tail Control; 4" TFT Display for Easy Control of all Bond Parameters; Simple Change between Ball Bonding and Wedge Bonding; Deep Access Bondhead 

Manual Wire Bonders - NDC International. NDC International represents the MPP (Micro Point Pro LTD) line of manual wire bonders in the USA, Mexico and Canada. The long time leader in wire

Bonding single wires with TPT's HB100 automatic wire bonder.For more information visit: https://www.tpt-wirebonder.com/hb100/

The HB05 is a bench top size wire bonder, ideal for laboratories and pilot production lines. One bond head for bonding in ball/wedge or wedge/wedge bonding